Ultra High Precision Machining

Sanluo Precision is a leading manufacturer and supplier of ultra high precision machining in China, with core technology in nano-level precision manufacturing, providing customers with top-level precision machining services. We provide professional customized high precision machining services for aerospace, optical communication, semiconductor, medical equipment and other high-end fields, and support the customization of complex and difficult parts. We can achieve nanometer-level machining accuracy, fully meeting the extreme precision requirements of cutting-edge manufacturing industry for ultra high precision machining.

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Product Description

Workstation Accuracy

dimensional accuracy	L（X）	W（Y）	H（Z）	SH	SW
unit:±/mm	0.001	0.0005	0.0001	0.001	0.001
Geometric accuracy	flatness	parallelism	perpendicularity	roughness	symmetry
unit:±/mm	0.0003	0.001	0.001	Ra0.05	0.001
production capacity	1~999999 pcs	1~999999 pcs	1~999999 pcs	1~999999 pcs	1~999999 pcs
production cycle	3-20 days	3-20 days	3-20 days	3-20 days	3-20 days

Ultra High Precision Core Technology

Sanluo Precision's ultra high precision machining adopts a series of core technologies: ultra-precision machine tool (aerostatic spindle, hydrostatic guide rail, thermal error compensation, vibration isolation system), diamond turning (surface roughness Ra0.01-0.05μm, roundness 0.0005mm), ion beam machining (nanometer-level surface modification, accuracy ±0.0001mm), laser micromachining (micro-hole diameter 0.005-0.1mm, position accuracy ±0.001mm), chemical mechanical polishing CMP (surface roughness Ra0.001-0.01μm), precision assembly (submicron-level positioning accuracy). Process control: constant temperature workshop (temperature ±0.5℃), humidity control 40-60%, dust-free level Class 1000, anti-vibration foundation (vibration amplitude <0.1μm).

Application Scenarios

Application cases of ultra high precision machining: aerospace (gyroscope rotor roundness 0.0005mm, dynamic balance G0.1 grade), optical communication (optical fiber connector end face Ra0.01μm, insertion loss <0.1dB), semiconductor (wafer chuck flatness 0.001mm, vacuum adsorption force uniformity ±1%), medical equipment (artificial joint surface Ra0.02μm, wear resistance >10 million cycles), precision instruments (atomic force microscope probe tip radius 5-10nm). We have provided customized high precision machining services to Aerospace Science and Technology Group, Huawei, ZTE, BYD and other enterprises, with a product qualification rate of 99.98%.

Equipment Technical Parameters

Parameter Category	Parameter Details
Equipment Model	Nanoform X
Core Positioning	Ultra-precision diamond turning and grinding machine for optical and mechanical components
Axis Number	5-axis (X, Y, Z, B, C)
Key Accuracy	Positioning accuracy ±0.1μm, repeatability ±0.05μm
Spindle System	Air-bearing spindle, rotation accuracy <50nm
Control System	Nanometer-level motion control system
Processing Range	Maximum workpiece diameter 600mm, maximum workpiece weight 500kg
Core Advantage	Achieves optical grade surface quality on non-ferrous metals and plastics
Typical Application	ultra high precision machining of optical lenses, mirrors, precision molds

Parameter Category	Parameter Details
Equipment Model	UPL 150
Core Positioning	Ultra-precision milling and turning composite machining
Axis Number	4-axis (X, Y, Z, C)
Key Accuracy	Machining accuracy ±0.0001mm, surface roughness Ra0.01μm
Spindle System	High-speed air-bearing spindle, maximum speed 80,000 rpm
Structural Features	Granite bed, active vibration isolation system
CNC System	Siemens 840D sl
Typical Application	ultra high precision machining of micro-components, precision sensors