Laser Micro Drilling

Sanluo Precision is a professional manufacturer and supplier of laser micro drilling in China, with 18 years of experience in precision micro-hole processing technology, providing customers with high-quality laser beam machining services. It offers professional customized precision micro machining services for electronic packaging, medical catheters, filter devices and other fields, and supports the customization of complex and difficult parts. It realizes the precision processing of micron-level small holes, deep holes, special-shaped holes and array holes, fully meeting the stringent requirements of various industries for laser micro drilling.

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Product Description

Micro-hole Processing Technology

The laser micro drilling technology adopted by Sanluo Precision's processing plant uses high-energy laser beams to focus and drill holes. Drilling principle: The laser instantly heats the material to its boiling point, the material vaporizes to form holes, and the auxiliary gas blows away the molten material. Hole diameter range: φ10-500μm, minimum hole diameter φ5μm. Depth-diameter ratio: ≥20:1, significant advantages in deep hole processing. Diverse hole types: round holes, square holes, special-shaped holes, directly formed by laser. Hole wall quality: taper ≤2°, roundness ≥95%, wall surface roughness Ra0.5-2μm. Single hole speed: 0.01-1 second, high efficiency in batch processing of array holes. Applicable materials: metals, ceramics, glass, plastics, composite materials can all be drilled.

Station Accuracy

Dimensional accuracy	OD	ID	T（C）	DP	SH
unit:±/mm	0.002	0.001	0.005	0.002	0.001
Geometric accuracy	Roundness	Coaxiality	Straightness	Cylindricity	Concentricity
unit:±/mm	0.002	0.006	0.002	0.005	0.002
Production capacity	1~999999 pcs	1~999999 pcs	1~999999 pcs	1~999999 pcs	1~999999 pcs
Production cycle	3-20 days	3-20 days	3-20 days	3-20 days	3-20 days

Precision Hole Processing Technology

As a professional manufacturer of laser micro drilling, Sanluo Precision has refined and optimized the process. Single-pulse drilling: completed with a single pulse, fast speed, suitable for φ<100μm holes in thin materials. Multi-pulse drilling: multi-pulse superposition, hole diameter φ100-300μm, depth 5mm. Spiral drilling: laser spiral scanning, large hole diameter φ300-1000μm, large depth-diameter ratio. Sleeve hole process: first drill a small guide hole, then drill a large hole with high precision. Parameter control: precise control of pulse energy, frequency, defocus amount and auxiliary air pressure. Array drilling: CNC positioning for batch drilling, hole pitch accuracy ±5μm, hole diameter consistency <3%. Online detection: CCD coaxial observation, laser ranging to ensure quality.

Application Fields

Sanluo Precision's laser micro drilling is applied in a variety of scenarios, such as film cooling holes of engine turbine blades, with a hole diameter of φ0.3-1mm, an inclination angle of 15°-30°, and thousands of holes; sweat cooling hole arrays of combustion chamber flame tubes, with a hole diameter of 0.2-0.5mm and a hole pitch of 1-3mm. Via holes of ceramic substrates for electronic packaging, with a hole diameter of 50-300μm, metallized through holes; micro holes of IC substrates, with a diameter of φ20-100μm and a depth-diameter ratio of 15:1. Side holes of medical device catheters, with a hole diameter of 100-500μm for drug release; membrane holes of dialyzers, with a hole diameter of 10-50μm and uniform distribution. Micro holes of stainless steel filter screens for filter devices, with a hole diameter of φ20-200μm and a hole density of 10-100 pcs/cm². Sanluo Precision has provided customized laser beam machining services for AVIC, Foxconn, Medtronic and other enterprises, with an annual drilling volume of over 100 million holes, stable quality and reliable accuracy.

Technical Parameters of Laser Micro Drilling Equipment

Parameter Category	Parameter Details
Equipment model	MiDril 40P ultrafast laser double-station micro-hole processing equipment
Core positioning	Efficient and high-precision double-station parallel micro-hole processing
Number of axes and stations	Multi-axis, double spindle, double-station parallel processing
Stroke (X1 /Y1 /Z1)	400 mm / 400 mm / 450 mm
Hole making range	Φ0.005mm ~ Φ1.5 mm (the hole making range of the new model is Φ0.0025mm~Φ2.5mm)
Key accuracy	Hole diameter accuracy ±0.001mm, depth-diameter ratio ≥15:1
Surface quality	Surface roughness Ra 0.4 (Note: Ra0.2μm for the new model)
Core technology	Multi-channel beam splitting technology realizes high-power femtosecond laser beam splitting and asynchronous processing; independent beam scanning module supports the processing of curved surface complex microstructures
Core advantages	The comprehensive efficiency is improved by more than 70%, suitable for high-quality, precision and efficient processing of film holes and fuel nozzles
Typical applications	Precision laser micro drilling parts, etc

Parameter Category	Parameter Details
Equipment model	DS 5-axis femtosecond special-shaped micro-hole forming equipment (specific model/)
Core positioning	Non-thermal damage precision processing of complex new materials (such as ceramic matrix composites)
Number of axes	5-axis
Laser parameters	Femtosecond laser with pulse width as narrow as 80fs, focused spot diameter only φ5μm
Key accuracy	The processing hole position deviation is stably controlled within ±2μm
Intelligent function	Equipped with the "intelligent compensation" function, which can automatically detect the thermal expansion coefficient of the material and adjust the processing path in real time before processing
Core advantages	Extremely small heat-affected zone, capable of processing ceramic matrix composites without cracking; intelligent adjustment ensures high precision
Typical applications	Precision laser micro drilling parts, etc